Improved environmental and safety performance with semiconductor sensors manufactured using leading technology MEMS are microstructures manufactured on semiconductor wafers using semiconductor process technologies. In recent years, the MEMS technology has been widely applied to various devices for sensors, ink-jet printer heads, and other products.

Protective layer is formed partly on the surface of a semiconductor wafer, then the unprotected potion is etched deeply to form three-dimensional micromechanical components. DENSO has developed a technology for deeper and narrower trench not possible before, thus expanding the range of MEMS applications. DENSO is using this technology to mass-produce components for G sensors that activate air bags upon detecting a collision. In addition, based on this technology, DENSO has been developing optical components, such as prisms for laser sensors and other products.

DENSO has continuously improved its semiconductor technologies since the early 1970’s. With this history, DENSO’s semiconductor technologies offer the world’s deepest etching for MEMS applications.